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Clarification of eligible uses of Defense Industrial Base Fund

Division A · Title XVIII: Revitalization of the Defense Industrial Base · Subtitle B: Provisions Relating to Defense Industrial Base Manufacturing

Plain-language summaryAI

The section expands the allowed uses of the Defense Industrial Base Fund to include ship and submarine technologies, infrastructure for their construction and repair, and advanced microelectronics packaging capabilities. It also prohibits using funds allocated before this law's enactment for these newly added purposes.

AI-generated from this section’s text — a quick orientation, not a substitute for the full text below. Not legal advice.

Section Text · Sec. 1831.
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(a) In general

Section 4817(g)(1) of title 10, United States Code, as added by section 867 of the National Defense Authorization Act for Fiscal Year 2026 ( Public Law 119–60 ), is amended—

(1)

by amending subparagraph (L) to read as follows:

(L)

Ships or submarines, including technologies and capabilities supporting the assembly or automation of ships or submarines, new or modernized infrastructure for the construction of ships or submarines, and infrastructure or capabilities for the maintenance, sustainment, or battle-damage repair of ships or submarines (including private-sector drydock and ship repair infrastructure components and systems).

(2)

by adding at the end the following new subparagraph:

(P)

Advanced microelectronics packaging, including substrates, interposers, heterogeneous integration, and related manufacturing capability and capacity.

(b) Limitation on use of certain funds

The Secretary of Defense may not use funds made available before the date of the enactment of this Act to carry out activities under the authority of subsection (g)(1)(L) or (g)(1)(P) of section 4817 of title 10, United States Code, as added by this Act.